Rapidus Corporation, Japan’s flagship advanced semiconductor company, has announced a strategic partnership with Siemens Digital Industries Software to advance the development and manufacturing of 2-nanometer (2nm) semiconductor chips. This collaboration represents a critical milestone in Japan’s national mission to restore its leadership in the global semiconductor supply chain while enabling next-generation computing technologies.
? Leading the Future of High-Performance Semiconductors
The partnership will combine Rapidus’ cutting-edge fabrication capabilities with Siemens’ world-class electronic design automation (EDA) and digital twin technologies. This synergy will support the rapid development and commercialization of ultra-miniaturized, energy-efficient 2nm chips, essential for:
? Artificial Intelligence (AI)
? 6G communications
? Advanced automotive and mobility systems
? High-performance computing (HPC)
Rapidus is positioning itself as a pioneer in bringing 2nm process nodes to commercial-scale production by the late 2020s, challenging the dominance of existing foundry giants in Taiwan and South Korea.
? Siemens Xcelerator Platform as the Digital Backbone
Siemens will provide its Xcelerator portfolio, a suite of integrated software, services, and application development tools, to support end-to-end semiconductor lifecycle management—from design and simulation to manufacturing optimization.
Through digital twins, Rapidus can simulate chip performance, optimize fabrication, and reduce costly trial-and-error in physical prototyping. This will significantly accelerate:
?️ Factory ramp-up and yield improvement
? Process innovation and defect prediction
? Real-time quality assurance and analytics
?? Strengthening Japan’s Semiconductor Sovereignty
Backed by support from the Japanese government, Rapidus is at the heart of Japan’s initiative to rebuild a domestic semiconductor ecosystem and secure supply chain resilience amid global geopolitical tensions. This partnership with Siemens reinforces that effort by:
?️ Establishing globally competitive design-to-fab capabilities
? Attracting international talent and ecosystem partnerships
? Supporting collaboration with U.S. and EU chip alliances
? Toward a New Era of Chip Innovation
The 2nm technology node is viewed as a critical inflection point in chip performance, enabling more powerful, compact, and energy-efficient devices. By joining forces, Rapidus and Siemens aim to:
Set new standards in chip design and manufacturing excellence
Lead the global race for sub-3nm commercial viability
Enable industry-wide digital transformation, from mobility to healthcare to infrastructure.
? Read the full analysis at- Rapidus, Siemens partner to advance 2nm Chip production
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